METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

摘要

A method for forming a conductor film, which allows the reduction in the thickness of a conductor film formed for an electronic component, and can form, at once, conductor films continuously extending over first and second surfaces of an electronic component which intersect one another. A component body is disposed to be opposed to a discharge nozzle for discharging an coating material which serves as a material for a conductor film, and the coating material charged by applying a voltage between the discharge nozzle and the component body (2) is discharged from the discharge nozzle. The charged coating material is applied to the component body along lines of electric force.

主权项

1. A method for manufacturing an electronic component comprising a component body including at least first and second surfaces intersecting one another; and a conductor film formed on the component body to continuously extend over at least the first surface and second surface,
the method comprising the steps of: preparing a component body; preparing a fluid coating material containing a conductive material as a material for the conductor film; placing the component body to be opposed to a discharge nozzle for discharging the coating material; and with the coating material charged by applying a voltage between the discharge nozzle and the component body, discharging the coating material from the discharge nozzle and applying the charged coating material to the component body, thereby forming the conductor film containing the conductive material simultaneously to continuously extend over at least the first surface and second surface of the component body.