NON-PERMEABLE SUBSTRATE CARRIER FOR ELECTROPLATING

摘要

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

主权项

1. A substrate carrier for electroplating a plurality of substrates, the substrate carrier comprising:
a non-conductive carrier body for holding the substrates, an area of the non-conductive carrier body that is directly behind the substrates being continuous so as to be impermeable to flow of electroplating solution through the area of the non-conductive carrier body; a plurality of aligning features on the non-conductive carrier body, wherein the aligning features are arranged to surround and align the substrates; and electrically-conductive lines embedded within the non-conductive carrier body.