| 摘要 |
Provided are a communication system and a communication device therefor, the communication device comprising a bottom casing and a printed circuit board mounted on the bottom casing, the communication device also comprising a heat conduction mounting strip, the printed circuit board being mounted on the bottom casing via the heat conduction mounting strip. A lower end surface of the heat conduction mounting strip is connected to the bottom casing, and an upper end surface of the heat conduction mounting strip is connected to the printed circuit board. Via application of the technical solution of the present invention, the communication device connects an edge of the printed circuit board to the bottom casing via the heat conduction mounting strip, so that a point contact of a printed circuit board and a bottom casing in the prior art becomes a surface contact, thereby improving the path for the printed circuit board to conduct and diffuse heat towards the bottom casing, and increasing the heat dissipation capability of the communication device. |
