| 发明名称 |
LOW COST HIGH STRENGTH SURFACE MOUNT PACKAGE |
| 摘要 |
A hermetically sealed package has an electrically insulating substrate, a plurality of electrically and thermally conductive tabs, and a lid. The electrically insulating substrate has a plurality of apertures and an aspect ratio of about 10:1 or greater. The plurality of electrically and thermally conductive tabs is hermetically joined to a bottom surface of the electrically insulating substrate and at least one tab covers each of the apertures. The lid is hermetically joined to a top surface of the electrically insulating substrate proximate to a perimeter of the electrically insulating substrate. |
| 申请公布号 |
US2016113138(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201414573631 |
申请日期 |
2014.12.17 |
| 申请人 |
RSM Electron Power, Inc. |
发明人 |
Au Ching;Zegzula Dennis;Peng David |
| 分类号 |
H05K5/06;H05K1/18;H05K5/03;H05K1/03;H05K1/09;H01L23/055;H05K1/02 |
主分类号 |
H05K5/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A hermetically sealed package comprising:
an electrically insulating substrate having a plurality of apertures, the electrically insulating substrate having an aspect ratio of about 10:1 or greater; a plurality of electrically and thermally conductive tabs hermetically joined to a bottom surface of the electrically insulating substrate and at least one tab covering each of the apertures; and a lid hermetically joined to a top surface of electrically insulating substrate, the lid being joined proximate a perimeter of the electrically insulating substrate. |
| 地址 |
Deer Park NY US |
