发明名称 THIN FILM TAPE FOR PROTECTING AGAINST HEAT
摘要 The present invention relates to an adhesive dissipating heat, and a method for manufacturing an ultra-thin heat dissipation tape comprising the same. The heat dissipation tape of the present invention does not use a solvent harmful to human body, such as toluene, and comprises a binder layer including a metal powder and a heat dissipation adhesive layer added with a carbon material or the like. The heat dissipation adhesive tape has excellent thermal conductivity, and can be used in electronic products in various fields, such as a smart phone, a laptop, and a tablet PC.
申请公布号 KR20160043253(A) 申请公布日期 2016.04.21
申请号 KR20140137339 申请日期 2014.10.13
申请人 SAMSUNG ELECTRONICS CO., LTD.;CHEM CO CO., LTD. 发明人 KIM, JAE WAN;KO, SEI YOUN;KIM, KWANG JAE;MOON, DAE SUNG;AHN, HAE WON;LEE, WIE JAE;KANG, YOUNG SOO;KIM, MIN SU;LEE, YONG SOO
分类号 C09J7/02;C09J9/00;C09J11/04 主分类号 C09J7/02
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