摘要 |
The present invention relates to an adhesive dissipating heat, and a method for manufacturing an ultra-thin heat dissipation tape comprising the same. The heat dissipation tape of the present invention does not use a solvent harmful to human body, such as toluene, and comprises a binder layer including a metal powder and a heat dissipation adhesive layer added with a carbon material or the like. The heat dissipation adhesive tape has excellent thermal conductivity, and can be used in electronic products in various fields, such as a smart phone, a laptop, and a tablet PC. |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;CHEM CO CO., LTD. |
发明人 |
KIM, JAE WAN;KO, SEI YOUN;KIM, KWANG JAE;MOON, DAE SUNG;AHN, HAE WON;LEE, WIE JAE;KANG, YOUNG SOO;KIM, MIN SU;LEE, YONG SOO |