| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of securing the reliability related to prevention of electromigration and stress migration by using a low-cost reflow process.SOLUTION: A semiconductor device comprises: an interlayer insulating layer with a contact hole; a first alloy part formed in the contact hole; a second alloy part that covers a surface of the interlayer insulating layer; and a first material part formed of a first material and that extends so as to cover the first alloy part and the second alloy part.SELECTED DRAWING: Figure 1 |
