| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which allows for excellent flip-chip connection of a semiconductor chip.SOLUTION: A circuit board on which a semiconductor chip is flip-chip mounted includes: a power supply wiring pattern 22Vfor supplying a power supply potential to a semiconductor chip; signal wiring patterns 22S-22Sfor transmitting and receiving signals with the semiconductor chip; and a solder resist 23 covering a part of the power supply wiring pattern 22Vand a part of the signal wiring patterns 22S-22S, so that a connection 22C to be flip-chip connected is exposed in the openings 23a, 23b. Both the power supply wiring pattern 22Vand the signal wiring patterns 22S-22Sare formed to traverse the openings 23a, 23b of the solder resist 23. Since the conditional difference between the wiring patterns on the circuit board is reduced, poor connection of a bridge and the like can be prevented.SELECTED DRAWING: Figure 4 |
