PACKAGE FOR A MEMS SENSOR AND MANUFACTURING PROCESS THEREOF

摘要

A packaged MEMS device, wherein at least two support structures are stacked on each other and are formed both by a support layer and a wall layer coupled to each other and delimiting a respective chamber. The chamber of the first support structure is upwardly delimited by the support layer of the second support structure. A first and a second dice are accommodated in a respective chamber, carried by the respective support layer of the first support structure. The support layer of the second support structure has a through hole allowing wire connections to directly couple the first and the second dice. A lid substrate, coupled to the second support structure, closes the chamber of the second support structure.

主权项

1. A device, comprising:
a first substrate; a second substrate attached to the first substrate; a first chamber formed between the first substrate and the second substrate; a first die in the first chamber; a third substrate attached to the second substrate; a second chamber formed between the third substrate and the second substrate; and a second die positioned in the second chamber.