发明名称 |
METHOD FOR ETCHING MULTILAYER FILM |
摘要 |
The method according to one embodiment includes: (a) a step for etching an upper magnetic layer by means of plasma that is generated inside a processing vessel, wherein the etching of the upper magnetic layer is terminated at the surface of an insulating layer; (b) a step for removing deposits that have formed on the surface of a mask and of the upper magnetic layer as a result of the etching of the upper magnetic layer by means of the plasma generated inside the processing vessel; and (c) a step for etching the insulating layer by means of plasma that is generated inside the processing vessel. During the step for removing the deposits, a support structure that holds a workpiece is tilted and rotated and a pulse-modulated direct current voltage is applied to the support structure as a bias voltage for accumulating ions. |
申请公布号 |
WO2016060058(A1) |
申请公布日期 |
2016.04.21 |
申请号 |
WO2015JP78634 |
申请日期 |
2015.10.08 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
NISHIMURA EIICHI;OHATA MITSUNORI |
分类号 |
H01L43/12;H01L21/3065;H01L21/8246;H01L27/105;H01L43/08 |
主分类号 |
H01L43/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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