发明名称 METHOD FOR ETCHING MULTILAYER FILM
摘要 The method according to one embodiment includes: (a) a step for etching an upper magnetic layer by means of plasma that is generated inside a processing vessel, wherein the etching of the upper magnetic layer is terminated at the surface of an insulating layer; (b) a step for removing deposits that have formed on the surface of a mask and of the upper magnetic layer as a result of the etching of the upper magnetic layer by means of the plasma generated inside the processing vessel; and (c) a step for etching the insulating layer by means of plasma that is generated inside the processing vessel. During the step for removing the deposits, a support structure that holds a workpiece is tilted and rotated and a pulse-modulated direct current voltage is applied to the support structure as a bias voltage for accumulating ions.
申请公布号 WO2016060058(A1) 申请公布日期 2016.04.21
申请号 WO2015JP78634 申请日期 2015.10.08
申请人 TOKYO ELECTRON LIMITED 发明人 NISHIMURA EIICHI;OHATA MITSUNORI
分类号 H01L43/12;H01L21/3065;H01L21/8246;H01L27/105;H01L43/08 主分类号 H01L43/12
代理机构 代理人
主权项
地址
您可能感兴趣的专利