发明名称 SHEET METAL PROCESSING METHOD USING DIRECT DIODE LASER, AND DIRECT DIODE LASER PROCESSING DEVICE FOR CARRYING OUT SAID METHOD
摘要 When processing sheet-metal using a multi-wavelength laser, this sheet metal processing method and direct diode laser processing device result in minimal dross adhesion and allow adherent dross to be easily peeled off. In this sheet metal processing method and direct diode laser processing device, when cutting sheet metal that is 2mm thick or thicker, a laser from a DDL module is irradiated onto the sheet metal, condensed using a condenser lens which has a focal distance f ≧ 150mm and is arranged, with respect to the top surface of the sheet metal, at a focal position Pf with -2.0mm < Pf ≦ approximately 0.0 mm, and, when cutting sheet metal less than 2mm thick, irradiates a laser from the DDL module onto the sheet metal, condensed using a condenser lens which has a focal distance f ≦ 120mm and is arranged, with respect to the top surface of the sheet-metal, at a focal position Pf with 0.0mm < Pf ≦ 2.0mm.
申请公布号 WO2016059937(A1) 申请公布日期 2016.04.21
申请号 WO2015JP76458 申请日期 2015.09.17
申请人 AMADA HOLDINGS CO.,LTD. 发明人 ISHIGURO, HIROAKI;SUGIYAMA, AKIHIKO
分类号 B23K26/38;B23K26/064;B23K26/142 主分类号 B23K26/38
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