| 摘要 |
PROBLEM TO BE SOLVED: To achieve high speed chip mounting and high alignment accuracy, even when laminating chips in a plurality of layers.SOLUTION: A chip alignment method for aligning a chip CP on a substrate WA includes a recognition step for recognizing the corner Mc of a metal pattern provided on the chip CP, and a reference mark Mw provided on the joint surface Wf of the substrate WA, by infrared light emitted from at least one of the substrate WA side or the chip CP side, while arranging the substrate WA and chip CP oppositely, and an alignment step for aligning the substrate WA and chip CP based on the corner Mc and reference mark Mw thus recognized.SELECTED DRAWING: Figure 5 |
