| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of inhibiting slurry scattering in a processing chamber from adhering to a processing chamber side wall.SOLUTION: A polishing device includes: a chuck table configured to hold a processed object; a rotary spindle; a wheel mount fixed to a tip part of the spindle; a polishing wheel having a polishing pad detachably attached to the wheel mount; and processing feed means which moves the spindle in a direction perpendicular to a holding surface of the chuck table. The polishing device places the polishing pad in contact with the processed object held by the chuck table and performs polishing while supplying a polishing liquid including abrasive grains from a center of the polishing pad. The polishing device further includes: a housing formed by an upper wall and side walls, which enclose the chuck table and the tip part of the spindle including the polishing wheel, and defining a processing chamber therein; and jet means which is disposed on the side wall or the upper wall of the housing and sprays a liquid to turn an interior part of the processing chamber into a mist state.SELECTED DRAWING: Figure 2 |
