| 摘要 |
PROBLEM TO BE SOLVED: To peel a film, adhering to a corner in the processing container of a plasma processing apparatus, efficiently.SOLUTION: A plasma processing apparatus 1 for processing a wafer W by plasmarizing process gas has a processing container 2 for housing the wafer W airtightly, a susceptor 10 provided on the bottom face of the processing container 2, a gas supply pipe 50 for supplying at least any one of the process gas and purge gas into the processing container 2, a radial line slot antenna 3 generating plasma of process gas in the processing container 2, an exhaust mechanism 21 for evacuating the processing container 2 via an exhaust pipe 22, and an ultrasonic vibration generation mechanism 70 for applying an ultrasonic vibration to a corner of the processing container 2.SELECTED DRAWING: Figure 1 |
