发明名称 METHODS OF POST-PROCESS DISPENSATION OF PLASMA INDUCED DAMAGE PROTECTION COMPONENT
摘要 At least one method, apparatus and system disclosed herein involves providing an integrated circuit device comprising a protection circuit. And integrated circuit device is formed. A protection component is formed in parallel to the integrated circuit device. The protection component is configured for protecting the integrated circuit device from a portion of a charge. A circuit break device in series to the protection component, wherein the protection component and the circuit break device are in parallel to the integrated circuit device. The circuit break device is configured to break an electrical path of the protection component for electrically terminating the protection component based upon a current signal.
申请公布号 US2016111867(A1) 申请公布日期 2016.04.21
申请号 US201414517605 申请日期 2014.10.17
申请人 GlobalFoundries, Inc. 发明人 Bousquet Arnaud;Aluri Geetha Sai;Uppal Suresh
分类号 H02H3/08;H01L23/525;H01L29/78;H01L49/02;H01L21/8234;H01L29/66;H01L21/66;H01L27/02 主分类号 H02H3/08
代理机构 代理人
主权项 1. A method terminating a protection component, comprising: forming an integrated circuit device; forming a protection component in parallel to said integrated circuit device, said protection component being configured for protecting said integrated circuit device from a portion of a charge; and forming a circuit break device in series to said protection component wherein said protection component and said circuit break device are positioned in parallel to said integrated circuit device, and wherein said circuit break device is configured to break an electrical path of said protection component for electrically terminating said protection component based upon a current signal.
地址 Grand Cayman KY