发明名称 Application of Fluids to Substrates
摘要 Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.
申请公布号 US2016107183(A1) 申请公布日期 2016.04.21
申请号 US201514978507 申请日期 2015.12.22
申请人 Infineon Technologies AG 发明人 Pilch Karl;Leitner Hans;Kalin Michael
分类号 B05B12/02;B05B13/02 主分类号 B05B12/02
代理机构 代理人
主权项 1. An apparatus comprising: a substrate holder; a fluid application device configured to apply a fluid to a substrate on the substrate holder; a heating mechanism configured to locally heat the fluid; and a controller configured to control the heating mechanism to apply a local heating in order to obtain a desired thickness profile of the fluid on the substrate.
地址 Neubiberg DE