发明名称 |
Application of Fluids to Substrates |
摘要 |
Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile. |
申请公布号 |
US2016107183(A1) |
申请公布日期 |
2016.04.21 |
申请号 |
US201514978507 |
申请日期 |
2015.12.22 |
申请人 |
Infineon Technologies AG |
发明人 |
Pilch Karl;Leitner Hans;Kalin Michael |
分类号 |
B05B12/02;B05B13/02 |
主分类号 |
B05B12/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. An apparatus comprising:
a substrate holder; a fluid application device configured to apply a fluid to a substrate on the substrate holder; a heating mechanism configured to locally heat the fluid; and a controller configured to control the heating mechanism to apply a local heating in order to obtain a desired thickness profile of the fluid on the substrate. |
地址 |
Neubiberg DE |