SEMICONDUCTOR LASER ELEMENT AND METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR LASER DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor laser element capable of obtaining high reliability by suppressing occurrence of short-circuit.SOLUTION: A manufacturing method for obtaining a plurality of semiconductor laser elements by dividing a semiconductor wafer 100 along a first line 75 parallel to a resonator width direction and a second line 76 parallel to a resonator length direction comprises the steps of: preparing the semiconductor wafer 100; forming a groove extending along the second line 76 on one principal surface side of the semiconductor wafer 100 and forming a first uneven pattern 30 at a bottom of the groove along the second line 76; forming a second uneven pattern 50 along the second line 76 by coating at least a part of the first uneven pattern 30 with a protective film 40; and dividing the semiconductor wafer 100 along the first line 75 and dividing the semiconductor wafer 100 along the second line 76 using the other principal surface side of the semiconductor wafer 100 as a starting point.SELECTED DRAWING: Figure 6