| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for enhancing the productivity of a process for mounting an electronic component on a mounting board.SOLUTION: A method of producing a module by attaching an electronic component, having a second connection terminal on a connection surface, to a mounting board having a first connection terminal on the mounting surface has the steps of: superposing the mounting board and the electronic component so that solder paste is sandwiched, respectively, between the first connection terminal and the second connection terminal and between a pad provided on one of the mounting surface or the connection surface and the other of the mounting surface or the connection surface; and fusing the solder paste by heating. Contact angle of the fused solder paste for a part facing the pad on the other of the mounting surface or the connection surface is larger than the contact angle of the fused solder paste for the first connection terminal, the second connection terminal and the pad.SELECTED DRAWING: Figure 2 |
