| 摘要 |
[Problem] To bond substrates together so that voids are prevented from forming between the substrates, strain is minimized, and bonding is performed at a high positional accuracy. [Solution] A method for bonding a first substrate and a second substrate together, wherein the method is provided with: a step for performing a hydrophilic treatment in which water or an OH-containing substance is caused to adhere to the surface of the respective bonding surface of the first substrate and the second substrate; a step for disposing the first substrate and the second substrate so that the bonding surfaces face each other, and causing the first substrate to deflect so that the center part protrudes towards the second substrate side in relation to the outer peripheral part of the bonding surface; a step for causing the bonding surface of the first substrate and the bonding surface of the second substrate to abut each other at the center parts; and an abutting step for causing the distance between the outer peripheral part of the first substrate and the outer peripheral part of the second substrate to be reduced once the center parts have been caused to abut each other at a pressure at which a non-bonding state is maintained, and causing the bonding surface of the first substrate and the bonding surface of the second substrate to abut each other across the entire surface. |
