PROCESSING MODULE, PROCESSOR, AND PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To improve polishing precision on a polishing processing surface of a processing object.SOLUTION: In an upper-side processing module 300A, the polishing processing is performed by moving a wafer W and a pad 502 relatively to each other while keeping the pad 502 having a smaller diameter than the wafer W in contact with the wafer W. The upper-side processing module 300A includes: a state detection part 910 which detects a state of a polishing processing surface of the wafer W before performing polishing processing or during executing the polishing processing; and a control part 920 which controls polishing processing conditions in one portion of the polishing processing surface of the wafer W in accordance with the state of the polishing processing surface detected by the state detection part 910.SELECTED DRAWING: Figure 5