发明名称 POWER CONVERSION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a power conversion device that suppresses a bypass flow and has excellent radiation performance.SOLUTION: A power conversion device comprises: a power semiconductor module 300; and a passage formation body 1000 in which the power semiconductor module 300 is disposed. The power semiconductor module 300 includes: a high heat conductor 920 disposed at a position sandwiched between a semiconductor chip and the passage formation body 1000; and an encapsulation material for encapsulating the power semiconductor element and the high heat conductor 920. The high heat conductor 920 includes a fin that is on the passage formation body 1000 side and protrudes toward the passage formation body 1000, where the tip of the fin and part of the encapsulation material surrounding the fin are approximately on the same plane.SELECTED DRAWING: Figure 12
申请公布号 JP2016059148(A) 申请公布日期 2016.04.21
申请号 JP20140182844 申请日期 2014.09.09
申请人 HITACHI AUTOMOTIVE SYSTEMS LTD 发明人 TSUYUNO ENJO;IDE HIDEKAZU;TOKUYAMA TAKESHI
分类号 H02M7/48;H01L23/473;H01L25/07;H01L25/18;H05K7/20 主分类号 H02M7/48
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