| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method by which a chamfered part of a wafer can be removed without damaging a rigid plate that is stuck to the wafer.SOLUTION: A workpiece (11) is formed by sticking a disk-shaped wafer (13) to a rigid plate (15). The wafer includes a chamfered part (13c) from a front face (13a) to a rear face (13b) in an outer circumference. The processing method is configured to remove the chamfered part of the workpiece by a plurality of cutting blades (48 and 50). The processing method includes a cutting step in which the plurality of cutting blades are moved down towards the workpiece (11) in the state where the plurality of cutting blades an a chuck table (14) are rotated in such a manner that a direction of movement of the cutting blades and a direction of movement of the wafer are inverted at processing points where the plurality of cutting blades and the wafer are brought into contact. The plurality of cutting blades are made perform cutting to a sticking face between the wafer and the rigid plate, thereby removing the chamfered part of the wafer.SELECTED DRAWING: Figure 3 |
