DIELECTRIC COVER FOR A THROUGH SILICON VIA

摘要

An approach to creating a semiconductor structure for a dielectric layer over a void area includes determining a location of a void area of the topographical semiconductor feature. A second dielectric layer is deposited on a first dielectric layer and a top surface of a topographical semiconductor feature. The second dielectric layer is patterned to one or more portions, wherein at least one portion of the patterned second dielectric layer is over the location of the void area of the topographical semiconductor feature. A first metal layer is deposited over the second dielectric layer, at least one portion of the first dielectric layer, and a portion of the top surface of the topographical semiconductor feature. A chemical mechanical polish of the first metal layer is performed, wherein the chemical mechanical polish reaches the top surface of at least one of the one or more portions of the second dielectric layer.

主权项

1. A semiconductor structure, the structure comprising:
a first dielectric layer covering a barrier layer and adjacent a topographical semiconductor feature, wherein the topographical semiconductor feature has a void area; a patterned second dielectric layer covering the void area of the topographical semiconductor feature and at least one portion of the first dielectric layer; and a first metal layer covering a portion of the topographical semiconductor feature, a portion of the patterned second dielectric layer covering the void area of the topographical semiconductor feature, and a portion of the first dielectric layer.