CHIP COMPONENT

摘要

A chip component includes: a ceramic body including a capacitance forming part in which first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body, wherein the capacitance forming part includes first and second internal electrodes spaced apart from each other on the first dielectric layers and exposed to the end surfaces of the ceramic body to thereby be connected to the external electrodes; and floating electrodes disposed on the second dielectric layers and overlapped with portions of the first and second internal electrodes, the ceramic body includes protective parts disposed between upper and lower surfaces thereof and the capacitance forming part and having third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed, and the protective parts include third dummy electrodes disposed between the first and second dummy electrodes.

主权项

1. A chip component comprising:
a ceramic body including a capacitance forming part in which a plurality of first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body in a length direction thereof, wherein the capacitance forming part includes: first and second internal electrodes disposed on the plurality of first dielectric layers to be spaced apart from each other and exposed to the end surfaces of the ceramic body to thereby be connected to the external electrodes; and floating electrodes disposed on the plurality of second dielectric layers and overlapped with portions of the first and second internal electrodes, the ceramic body further includes protective parts disposed between at least one of upper and lower surfaces of the ceramic body and the capacitance forming part and having a plurality of third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed, and the protective parts further include third dummy electrodes disposed between the first and second dummy electrodes.