SEMICONDUCTOR CHIP MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor chip manufacturing method which can reduce a cutting width narrower than the existing width.SOLUTION: A semiconductor chip manufacturing method of the present embodiment comprises: a process of forming fine grooves 140-1, 140-2 on a surface side along a cutting region from the surface of the substrate by anisotropic dry etching; a process of irradiating laser beams on the inside of the substrate along the fine grooves of the cutting region to form reformed regions 320, 330 and the like along the cutting region and inside the substrate; and a process of dividing the substrate along the cutting region to semiconductor chips.SELECTED DRAWING: Figure 6