PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS

摘要

A packaged semiconductor device includes a substrate, a die, at least one electrical connector, a first mold compound formed of translucent material, and a second mold compound. A first face of the die is electrically and mechanically coupled to the substrate. The at least one electrical connector electrically couples at least one electrical contact on a second face of the die with at least one conductive path of the substrate. The first mold compound formed of a translucent material at least partially encapsulates the die and the at least one electrical connector. The second mold compound at least partially encapsulates the first mold compound and forms a window through which the first mold compound is exposed. In implementations the second mold compound is opaque and the first mold compound is transparent. In implementations the substrate includes a lead frame having a die flag and a plurality of lead frame fingers.

主权项

1. A packaged semiconductor device, comprising:
a substrate; a die mechanically coupled to the substrate at a first face of the die; at least one electrical connector electrically coupling at least one electrical contact on a second face of the die with at least one conductive path of the substrate; a first mold compound, comprised of a translucent material, at least partially encapsulating the die and the at least one electrical connector; and a second mold compound partially encapsulating the first mold compound and forming a window through which the first mold compound is exposed; wherein the substrate extends continuously outwardly from under the first face of the die, the first mold compound, and the second mold compound to an outer edge of the second mold compound.