| 发明名称 |
Semiconductor Component Having Inner and Outer Semiconductor Component Housings |
| 摘要 |
A semiconductor component includes an inner semiconductor component housing and an outer semiconductor component housing. The inner semiconductor component housing includes a semiconductor chip, a first plastic housing composition and first housing contact surfaces. At least side faces of the semiconductor chip are embedded in the first plastic housing composition and the first housing contact surfaces are free of the first plastic housing composition and include a first arrangement. The outer semiconductor component housing includes a second plastic housing composition and second housing contact surfaces which include a second arrangement. The inner semiconductor component housing is situated within the outer semiconductor component housing and is embedded in the second plastic housing composition. At least one of the first housing contact surfaces is electrically connected with at least one of the second housing contact surfaces. |
| 申请公布号 |
US2016111346(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201514879904 |
申请日期 |
2015.10.09 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
Hoeglauer Josef;Lee Tek Sim;Otremba Ralf;Schiess Klaus;Schloegel Xaver;Schredl Juergen |
| 分类号 |
H01L23/08;H01L23/31;H01L23/498 |
主分类号 |
H01L23/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor component, comprising:
an inner semiconductor component housing with a semiconductor chip, a first plastic housing composition and first housing contact surfaces, wherein at least side faces of the semiconductor chip are embedded in the first plastic housing composition and the first housing contact surfaces are free of the first plastic housing composition and comprise a first arrangement; and an outer semiconductor component housing with a second plastic housing composition and second housing contact surfaces which comprise a second arrangement, wherein the inner semiconductor component housing is situated within the outer semiconductor component housing and is embedded in the second plastic housing composition, wherein at least one of the first housing contact surfaces is electrically connected with at least one of the second housing contact surfaces. |
| 地址 |
Villach AT |
