| 摘要 |
A printed circuit board and a display apparatus. The printed circuit board comprises: a substrate; a packaging chip that is disposed on the first surface of the substrate and is provided with a chip main body; and a metal heat dissipation layer disposed on the second surface of the substrate. The projection of the metal heat dissipation layer on the first surface of the substrate comprises the region of the chip main body. According to the printed circuit board and the display apparatus, the metal heat dissipation layer is disposed on the back surface of the printed circuit board, so the temperature of the chip is reduced. |
