发明名称 RESIN COMPOSITION FOR LAMINATED PLATE, PREPREG, AND LAMINATED PLATE
摘要 PROBLEM TO BE SOLVED: To provide hydrous zinc molybdate (ZnMoO(OH)) for a printed wiring plate which can provide a resin composition for a laminated plate excellent especially in drilling workability, low thermal expansion, heat resistance, and electric insulation, and suitably used for a semiconductor package, and to provide a prepreg, a laminated plate, a printed wiring board, and slurry.SOLUTION: Hydrous zinc molybdate (ZnMoO(OH)) for a printed wiring plate has an atomic ratio of zinc to molybdenum of 3:2.SELECTED DRAWING: None
申请公布号 JP2016056094(A) 申请公布日期 2016.04.21
申请号 JP20150253411 申请日期 2015.12.25
申请人 HITACHI CHEMICAL CO LTD 发明人 TAKAHASHI YOSHIHIRO;KAMIGATA YASUO;AOSHIMA MASAHIRO;MURAI HIKARI
分类号 C01G39/00;B32B9/00;B32B15/08;C08J5/24;H05K1/03 主分类号 C01G39/00
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