发明名称 STRUCTURE AND FORMATION METHOD OF DAMASCENE STRUCTURE
摘要 A structure and a formation method of a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a first conductive feature over the semiconductor substrate. The semiconductor device also includes a first dielectric layer over the semiconductor substrate and surrounding the first conductive feature. The semiconductor device further includes a second conductive feature over the first conductive feature, and the second conductive feature extends into the first conductive feature. In addition, the semiconductor device includes a second dielectric layer over the first dielectric layer and surrounding the second conductive feature.
申请公布号 US2016111371(A1) 申请公布日期 2016.04.21
申请号 US201414516222 申请日期 2014.10.16
申请人 Taiwan Semiconductor Manufacturing Co., Ltd 发明人 PENG Tai-Yen;WU Chia-Tien;CHENG Jye-Yen
分类号 H01L23/532;H01L21/768;H01L23/528 主分类号 H01L23/532
代理机构 代理人
主权项 1. A semiconductor device, comprising: a semiconductor substrate; a first conductive feature over the semiconductor substrate; a first dielectric layer over the semiconductor substrate and surrounding the first conductive feature; a second conductive feature over the first conductive feature, wherein the second conductive feature extends into the first conductive feature; a second dielectric layer over the first dielectric layer and surrounding the second conductive feature; an etch stop layer between the first dielectric layer and the second dielectric layer, wherein the etch stop layer surrounds the first conductive feature; and an intermediate dielectric layer between the etch stop layer and the second dielectric layer, wherein the intermediate dielectric layer surrounds the first conductive feature and the second conductive feature.
地址 Hsin-Chu TW