发明名称 |
STRUCTURE AND FORMATION METHOD OF DAMASCENE STRUCTURE |
摘要 |
A structure and a formation method of a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a first conductive feature over the semiconductor substrate. The semiconductor device also includes a first dielectric layer over the semiconductor substrate and surrounding the first conductive feature. The semiconductor device further includes a second conductive feature over the first conductive feature, and the second conductive feature extends into the first conductive feature. In addition, the semiconductor device includes a second dielectric layer over the first dielectric layer and surrounding the second conductive feature. |
申请公布号 |
US2016111371(A1) |
申请公布日期 |
2016.04.21 |
申请号 |
US201414516222 |
申请日期 |
2014.10.16 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd |
发明人 |
PENG Tai-Yen;WU Chia-Tien;CHENG Jye-Yen |
分类号 |
H01L23/532;H01L21/768;H01L23/528 |
主分类号 |
H01L23/532 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device, comprising:
a semiconductor substrate; a first conductive feature over the semiconductor substrate; a first dielectric layer over the semiconductor substrate and surrounding the first conductive feature; a second conductive feature over the first conductive feature, wherein the second conductive feature extends into the first conductive feature; a second dielectric layer over the first dielectric layer and surrounding the second conductive feature; an etch stop layer between the first dielectric layer and the second dielectric layer, wherein the etch stop layer surrounds the first conductive feature; and an intermediate dielectric layer between the etch stop layer and the second dielectric layer, wherein the intermediate dielectric layer surrounds the first conductive feature and the second conductive feature. |
地址 |
Hsin-Chu TW |