| 摘要 |
A pressure contact IGBT packaging structure using a heat pipe, consisting of an outer casing and multiple sub-unit structures inside of the outer casing, the multiple sub-units being parallelly arranged; a sub-unit structure comprises an upper cap (1), an electrically conductive copper piece (2), a Belleville spring assembly (3), a heat pipe (9), a base (4), a silver piece (5), a molybdenum piece (6), a chip (8), and a lower cap (7); the lower cap, the chip, the molybdenum piece, the silver piece, and the base are arranged from bottom up in sequence; the upper end of the heat pipe inserts into the upper cap and penetrates the Belleville spring assembly, and the lower end inserts into the base; the upper end of the electrically conductive copper piece is between the upper cap and the Belleville spring assembly, and the lower end is between the Belleville spring assembly and the base. The introduction of the heat pipe enables good heat dissipating paths, protects the chip while providing relatively small heat resistance, and the overall structure enhances the reliability of pressure contact IGBT. |
