发明名称 LOW COST HIGH STRENGTH SURFACE MOUNT PACKAGE
摘要 A hermetically sealed package has an electrically insulating substrate, a plurality of electrically and thermally conductive tabs, and a lid. The electrically insulating substrate has a plurality of apertures and an aspect ratio of about 10: 1 or greater. The plurality of electrically and thermally conductive tabs is hermetically joined to a bottom surface of the electrically insulating substrate and at least one tab covers each of the apertures. The lid is hermetically joined to a top surface of the electrically insulating substrate proximate to a perimeter of the electrically insulating substrate.
申请公布号 WO2016061306(A1) 申请公布日期 2016.04.21
申请号 WO2015US55655 申请日期 2015.10.15
申请人 RSM ELECTRON POWER, INC. 发明人 AU, CHING;ZEGZULA, DENNIS;PENG, DAVID
分类号 H01L23/043 主分类号 H01L23/043
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