发明名称 |
LOW COST HIGH STRENGTH SURFACE MOUNT PACKAGE |
摘要 |
A hermetically sealed package has an electrically insulating substrate, a plurality of electrically and thermally conductive tabs, and a lid. The electrically insulating substrate has a plurality of apertures and an aspect ratio of about 10: 1 or greater. The plurality of electrically and thermally conductive tabs is hermetically joined to a bottom surface of the electrically insulating substrate and at least one tab covers each of the apertures. The lid is hermetically joined to a top surface of the electrically insulating substrate proximate to a perimeter of the electrically insulating substrate. |
申请公布号 |
WO2016061306(A1) |
申请公布日期 |
2016.04.21 |
申请号 |
WO2015US55655 |
申请日期 |
2015.10.15 |
申请人 |
RSM ELECTRON POWER, INC. |
发明人 |
AU, CHING;ZEGZULA, DENNIS;PENG, DAVID |
分类号 |
H01L23/043 |
主分类号 |
H01L23/043 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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