| 摘要 |
PROBLEM TO BE SOLVED: To determine a pressure set point of an optimal negative pressure that assures a desired overdrive amount by a vacuum suction force in wafer inspection in which a probe card and a wafer are contacted by a pressure.SOLUTION: In a prober, a pressure of a vacuum suction force applied between a probe card 36 and a wafer W within an enclosed space 82 by evacuation of a third vacuum mechanism 92 is made substantially accurately matched with a pressure of a pressing force that is applied between the probe card 36 and the wafer W by chuck top push-up of a movable stage 22 applied before the evacuation. This is because, regarding each of the probe cards 36 to be used in the prober, the third vacuum mechanism 92 for the overdrive holding reduces the pressure within the enclosed space 82 to a pressure set point Pthat is determined by pressure set point determination processing (method) for inspection under control of a controller.SELECTED DRAWING: Figure 3 |
