发明名称 EXTREME HIGH MOBILITY CMOS LOGIC
摘要 A CMOS device includes a PMOS transistor with a first quantum well structure and an NMOS device with a second quantum well structure. The PMOS and NMOS transistors are formed on a substrate.
申请公布号 US2016111423(A1) 申请公布日期 2016.04.21
申请号 US201514977479 申请日期 2015.12.21
申请人 Intel Corporation 发明人 Datta Suman;Hudait Mantu K.;Doczy Mark L.;Kavalieros Jack T.;AmIan Majumdar;Brask Justin K.;Jin Been-Yih;Metz Matthew V.;Chau Robert S.
分类号 H01L27/092;H01L29/12;H01L29/417;H01L29/66;H01L29/423;H01L21/8238;H01L21/02;H01L29/205;H01L29/51 主分类号 H01L27/092
代理机构 代理人
主权项 1. A transistor, comprising: a doped silicon semi-insulating substrate; a buffer layer disposed above the doped silicon semi-insulating substrate; a bottom barrier layer disposed above the buffer layer wherein the bottom barrier layer comprises a material different than the buffer layer; a group III-V material quantum well layer disposed above the bottom barrier layer; a top barrier layer disposed above the group III-V material quantum well layer; a gate stack disposed above the top barrier layer, the gate stack comprising: a high-k gate dielectric layer disposed above the top barrier layer; anda metal gate electrode disposed above the high-k gate dielectric layer; and raised source and drain regions disposed above an etch stop layer disposed above the top barrier layer, the raised source and drain regions disposed on either side of the gate stack.
地址 Santa Clara CA US