| 摘要 |
According to one embodiment of the present invention, a semiconductor module (10A) which comprises a plurality of first and second transistor chips (hereinafter, first and second transistors) (12A, 12B) and a substrate (90). First and second main electrode pads (18, 20) of the plurality of first transistors and second transistors are respectively electrically connected. The second main electrode pads of the first transistors are electrically connected to the first main electrode pads of the second transistors. Control electrode pads of the first and second transistors are connected via first and second resistance parts (13A, 13B) to first and second control electrode wiring patterns (94, 98) on the substrate. The first and second resistance parts have: a plurality of first and second resistance elements (72A, 72B) connected to the corresponding control electrode pads; and first and second linking parts (74A, 74B) which link the plurality of first and second resistance elements. |
