| 摘要 |
A fixture or clamp for a wafer in a vacuum treatment system comprises a non-conductive body with a first plane surface for arranging a substrate (wafer) thereon and a second surface opposite to said first surface. Said body includes a plurality of electrode-pairs; each electrode pair comprising a first electrode with a first electrode surface and a second electrode with a second electrode surface, said electrode surfaces interconnected via a conductive means and arranged essentially in parallel to said first and second surface, said first electrode located closer to said first surface than said second electrode and said second, electrode located closer to said second surface than said first electrode. Such a body influences can be used the RF coupling between wafer and pedestal on RF potential to achieve a uniform film stress profile/distribution during film deposition or other substrate treatment. |
