发明名称 半導体装置の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same capable of reading information on the semiconductor device with electromagnetic waves, without causing increase in size of the semiconductor device.SOLUTION: A semiconductor device comprises a semiconductor element 1, and resins 21, 22 configured to seal the semiconductor element 1, and an RFID tag 23 is embedded into the resins 21, 22.
申请公布号 JP5906948(B2) 申请公布日期 2016.04.20
申请号 JP20120124863 申请日期 2012.05.31
申请人 株式会社ソシオネクスト 发明人 土屋 誠;小池 弘之
分类号 H01L23/28;H01L21/56;H01L23/00;H01L23/12;H01L25/00 主分类号 H01L23/28
代理机构 代理人
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