Semiconductor package with improved testability

摘要

An exemplary implementation of the present disclosure includes a testable semiconductor package (100) that includes an active die (102) having interface contacts (112a-112c) and dedicated testing contacts (114a, 114b). An interposer (104) is situated adjacent a bottom surface (116a) of the active die (102), the interposer (104) providing electrical connections between the interface contacts (112a-112c) and a bottom surface (118a) of the testable semiconductor package. At least one conductive medium provides electrical connection between at least one of the dedicated testing contacts (114a, 114b) and a top surface (118b) of the testable semiconductor package. The at least one conductive medium can be coupled to a package-top testing connection (108a, 108b), which may include a solder ball.