| 摘要 |
The present invention provides a cutting method to obtain a pointing device, improving accuracy and productivity while allowing minimum consumption of an ultra-light alloy used for cutting when the pointing device manufactured with a single substrate having a large size is cut into a predetermined size. An adhesive layer including an adhesive film is formed on the rear surface of the substrate including a molding part, a line is primarily processed to form divided sections using an ultra-light alloy tool, and secondarily, cutting is precisely performed using the ultra-light alloy tool until the adhesive layer is exposed. Cutting to form uniform sections is allowed even by using a small number of ultra-light alloy tools. In addition, a non-economical disadvantage due to abrasion on the ultra-light alloy tool can be improved. |
