CURABLE COMPOSITION

摘要

The present invention relates to a curable composition and a use thereof. The curable composition of the present invention does not need a separate additional process for curing during production by enabling additional heat curing after partially polymerization reaction of a monomer mixture, can prevent adhesive omission or durability reduction due to excellent transparency and storage modulus when being applied to the adhesive, and can be helpfully applied to an optical member due to excellent embeddability and stepped overcoming properties.