| 摘要 |
The present invention is capable of providing a thermally conductive resin composition, which contains 70-20 parts by volume of (A) a polyester resin that has a melt viscosity at 200°C under a load of 10 kgf of 5-2,000 dPa·s and 30-80 parts by volume of (B) a thermally conductive filler, and which is capable of increasing the filling density of the filler, while maintaining good molding fluidity. In addition, the present invention is capable of providing a thermally conductive resin composition having good filler dispersibility by using a filler that is surface-treated with a coupling agent, and also capable of providing a thermally conductive resin composition having good wet heat resistance by using a filler that has a particle diameter frequency within a specific range. |
