BUFFING APPARATUS AND SUBSTRATE PROCESSING DEVICE

摘要

An object of the present invention is to perform a polishing while suppressing a substrate from being damaged or to effectively cleaning foreign substances having high adhesion. A buffing apparatus for buffing a substrate includes: a buff table for holding the substrate and configured to be rotatable, and a buff head to which a buff pad for buffing the substrate is attachable. The buff head is rotatable and movable in a direction of approaching the buff table and a direction away from the buff table. An internal supply line for supplying process liquid for the buffing to the substrate is formed inside the buff head. In addition, the buffing apparatus includes an external nozzle provided separately from the internal supply line in order to supply the process liquid to the substrate.