| 摘要 |
The present invention relates to an apparatus for manufacturing a semiconductor chip package, and more specifically, to an optical system including an infrared light capable of detecting a crack generated on a die, and a die bonding apparatus including the same. The optical system including an infrared light comprises a first lighting part, a second lighting part and an image sensor. The first lighting part emits a light in a visible light zone from a lower part of a die, which is supported by a pick-up member, to a surface of the die. The second light part emits a light in an infrared light zone from the lower part of the die to the surface of the die. The image sensor part obtains a first image reflected by the light emitted from the first lighting part, and a second image reflected by the light emitted from the second lighting part. |
