发明名称 SEMICONDUCTOR LAMINATE, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 Provided is a method for manufacturing a semiconductor device. Also provided are: a semiconductor device which can be obtained by the method; and a dispersion that can be used in the method. A method for manufacturing a semiconductor device (500a) of the present invention comprises the steps (a)-(c) described below and is characterized in that the crystal orientation of a first dopant implanted layer (52) is the same as the crystal orientation of a semiconductor layer or a base (10) that is formed of a semiconductor element. (a) A dispersion which contains doped particles is applied to a specific part of a layer or a base. (b) An unsintered dopant implanted layer is obtained by drying the applied dispersion. (c) The specific part of the layer or the base is doped with a p-type or n-type dopant by irradiating the unsintered dopant implanted layer with light, and the unsintered dopant implanted layer is sintered, thereby obtaining a dopant implanted layer that is integrated with the layer or the base.
申请公布号 EP2650908(A4) 申请公布日期 2016.04.20
申请号 EP20110846379 申请日期 2011.12.09
申请人 TEIJIN LIMITED 发明人 TOMIZAWA, YUKA;IKEDA, YOSHINORI;IMAMURA, TETSUYA
分类号 H01L21/20;C01B33/02;C30B13/00;C30B29/06;C30B33/02;H01L21/225;H01L29/04;H01L29/66;H01L31/06;H01L31/068;H01L31/18 主分类号 H01L21/20
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