发明名称 半導体を利用した発光デバイス
摘要 An LED light emitting device 5 as an example of a light emitting device utilizing a semiconductor to which the present invention is applied includes a package 10, a semiconductor light emitting element 200, a first sealing layer 50, and a second sealing layer 60. The semiconductor light emitting element 200 includes a p-n functioned semiconductor layer, and serves as a light source that emits light in accordance with application of a voltage to the semiconductor layer. The semiconductor light emitting element 200 is connected to power supply terminals 201 that supply a current.
申请公布号 JP5905648(B2) 申请公布日期 2016.04.20
申请号 JP20150526029 申请日期 2013.07.08
申请人 NSマテリアルズ株式会社 发明人 金野 潤;金海 榮一
分类号 H01L33/50;H01L33/52 主分类号 H01L33/50
代理机构 代理人
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