| 摘要 |
A substrate processing apparatus includes: a processing chamber; a support base; an electrostatic chuck; a chiller; a first channel; a second channel; a bypass channel; and a flow rate control valve. The first channel connects the chiller and a coolant entrance of the support base and the second channel connects the chiller and a coolant exit of the support base. The bypass channel branches from a midway of the first channel and is connected to a midway of the second channel. The flow rate control valve controls a flow rate of coolant flowing through the bypass channel. |
