| 摘要 |
Provided are: a sensing device which is able to be suppressed in decrease of sensing accuracy of a sensor due to heat during resin molding of the sensor; and a method for manufacturing a sensing device. A sensor module (3) is provided with: a magnetic field sensor (4) that comprises a sensor main body (40) containing a magnetic field sensing element (40a) and a plurality of lead wires (41) led out from the sensor main body (40); a container case (31) having a container part (31A) that contains the sensor main body (40); and a mold molded body (32) that is formed of a mold resin molded so as to contain at least a part of the container case (31) without coming into contact with the sensor main body (40). |
