CUSHIONED RELEASED COMPOSITE FILMS AND METHOD OF MATUFACTURING THE SAME

摘要

A shock-absorbing release composite film for a flexible printed circuit board (FPCB) comprises an intermediate layer and an outer layer formed on one side or both sides thereof. Provided is the shock-absorbing release composite film for a FPCB lamination process, in which the outer layer includes a polypropylene resin and an ultra-high molecular weight siloxane (UHMWS) resin, and the intermediate layer includes a polypropylene resin, a thermoplastic elastomer, and a UHMWS resin.