发明名称 部品供給装置
摘要 Disclosed is a component supply device for supplying electronic components to a chip mounter. The component supply device includes: holding members, each for holding at least one electronic component; an accommodation device having a plurality of accommodation units each of which can accommodate a holding member; identifiers attached to each holding member and in which identification information assigned to that holding member is recorded; a storage device for storing the identification information assigned to each holding member and one accommodation unit in which that holding member is to be set; and a reading device for reading the identification information recorded in the identifier of each holding member. When the identification information read by the reading device matches the identification information stored in the storage device, the accommodation device allows an operator to set the respective holding member in the one accommodation unit stored in the storage device.
申请公布号 JP5905111(B2) 申请公布日期 2016.04.20
申请号 JP20140537989 申请日期 2012.09.28
申请人 富士機械製造株式会社 发明人 寺岡 聖一;伊藤 利也;加古 哲也;塩谷 聡志;中井 健二
分类号 H05K13/02;H01L21/50;H01L21/52;H01L21/60 主分类号 H05K13/02
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