发明名称 化学研磨用表面保護フィルム
摘要 PROBLEM TO BE SOLVED: To provide a chemical-polishing surface protection film that not only prevents the intrusion of etchant but does not generate adhesive residues on an adherend.SOLUTION: Provided is a chemical-polishing surface protection film having an adhesive layer on one face of a resin film substrate, which is characterized in that: the thickness of the resin film substrate is 75 μm or more; the adhesive layer is formed by using an acrylic-type adhesive composition containing a silane coupling agent and a cross-linking agent; and there is no infiltration of hydrofluoric acid into a portion at a distance of 80 μm or more from the end of the laminated face of the chemical-polishing surface protection film on an adherend surface of an adherend of a glass substrate, for the duration of at least 150 seconds or more when checked after immersing the chemical-polishing surface protection film, in a state of being laminated via the adhesive layer onto the glass substrate, in a hydrofluoric acid solution at concentration of 15% and at temperature of 27°C.
申请公布号 JP5906222(B2) 申请公布日期 2016.04.20
申请号 JP20130177219 申请日期 2013.08.28
申请人 藤森工業株式会社 发明人 長倉 毅;島口 龍介;長谷川 良
分类号 C09J7/02;C03C15/00;C09J11/06;C09J133/06;C09J175/04 主分类号 C09J7/02
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