发明名称 |
Electronic package and method of connecting a first die to a second die to form an electronic package |
摘要 |
Some embodiments relate to an electronic package. The electronic package includes a substraten (11) that includes a plurality of buildup layers (12A,12B,12C). A first die (13) is embedded in one of the buildup layers on one side of the substrate. A second die(16) is bonded to the substrate within a cavity (17) on an opposing side of the substrate. The first die and the second die may be electrically connected to conductors within the plurality of buildup layers. Other embodiments relate to method of connecting a first die to a second die to form an electronic package. The method includes attaching a first die to a core and fabricating a substrate onto the core. The method further includes creating a cavity in another of the buildup layers on an opposing side of the substrate and attaching a second die to the substrate within the cavity. |
申请公布号 |
EP2924729(A3) |
申请公布日期 |
2016.04.20 |
申请号 |
EP20150155426 |
申请日期 |
2015.02.17 |
申请人 |
INTEL CORPORATION |
发明人 |
CHASE, HAROLD RYAN;MANUSHAROW, MATHEW J.;ROY, MIHIR K. |
分类号 |
H01L23/538;H01L25/065;H05K1/18 |
主分类号 |
H01L23/538 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|